18-12-2014, 11:10 AM
IC foundries gearing up for 8-inch fab expansions
Josephine Lien, Taipei; Jessie Shen, DIGITIMES [Wednesday 17 December 2014]
China-based IC foundry Semiconductor Manufacturing International (SMIC) is looking to expand production capacity at its 8-inch wafer fab in Shenzhen, while Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics (UMC) both plan to build additional capacity at their 8-inch fabs in China, according to company sources.
The Internet of Things (IOT) is being regarded as the next semiconductor growth opportunity. Major China- and Taiwan-based IC foundries are all gearing up for their 8-inch fab expansions in order to benefit from anticipated growth in semiconductors driven by the IoT.
SMIC has disclosed plans to expand capacity at its Shenzhen fab to 20,000 8-inch wafers monthly by the end of 2015 from 10,000 units in end-2014. Including production capacities at its other 8-inch fabs, SMIC's overall 8-inch fab capacity is set to exceed 150,000 units a month.
Since 2014, TSMC has been ramping up capacity at its Songjiang 8-inch fab in Shanghai. Monthly capacity at the facility has come to nearly 110,000 8-inch wafers from the previous 90,000 units.
UMC has also moved to expand its 8-inch production capacity in China. Subsidiary Hejian Technology will build an additional capacity of 11,000 8-inch wafers bringing its total monthly capacity to nearly 60,000 units.
http://www.digitimes.com/news/a20141216PD216.html
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S. Korean and Taiwanese Companies Control 56% of Global 300mm Fab Capacity
Vast majority of that wafer capacity is local to those two countries.
18 DEC 2014, by IC Insights
http://www.icinsights.com/data/articles/...ts/742.pdf
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Chip Business Picks Up In Japan
Posted on: December 16th, 2014 - Posted by: Kenji Tsuda
http://semiengineering.com/chip-business...-in-japan/
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Stanford 'high-rise' chip takes on IoT and big data
By layering processing and memory on top of each other, chips 'leap frog' in performance
By Sharon Gaudin
Computerworld | Dec 17, 2014
http://www.infoworld.com/article/2860356...-data.html
(vested)
Josephine Lien, Taipei; Jessie Shen, DIGITIMES [Wednesday 17 December 2014]
China-based IC foundry Semiconductor Manufacturing International (SMIC) is looking to expand production capacity at its 8-inch wafer fab in Shenzhen, while Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics (UMC) both plan to build additional capacity at their 8-inch fabs in China, according to company sources.
The Internet of Things (IOT) is being regarded as the next semiconductor growth opportunity. Major China- and Taiwan-based IC foundries are all gearing up for their 8-inch fab expansions in order to benefit from anticipated growth in semiconductors driven by the IoT.
SMIC has disclosed plans to expand capacity at its Shenzhen fab to 20,000 8-inch wafers monthly by the end of 2015 from 10,000 units in end-2014. Including production capacities at its other 8-inch fabs, SMIC's overall 8-inch fab capacity is set to exceed 150,000 units a month.
Since 2014, TSMC has been ramping up capacity at its Songjiang 8-inch fab in Shanghai. Monthly capacity at the facility has come to nearly 110,000 8-inch wafers from the previous 90,000 units.
UMC has also moved to expand its 8-inch production capacity in China. Subsidiary Hejian Technology will build an additional capacity of 11,000 8-inch wafers bringing its total monthly capacity to nearly 60,000 units.
http://www.digitimes.com/news/a20141216PD216.html
_____________________________________________________________________________________________________________
S. Korean and Taiwanese Companies Control 56% of Global 300mm Fab Capacity
Vast majority of that wafer capacity is local to those two countries.
18 DEC 2014, by IC Insights
http://www.icinsights.com/data/articles/...ts/742.pdf
___________________________________________________________________________________________________________
Chip Business Picks Up In Japan
Posted on: December 16th, 2014 - Posted by: Kenji Tsuda
http://semiengineering.com/chip-business...-in-japan/
______________________________________________________________________________________________________________
Stanford 'high-rise' chip takes on IoT and big data
By layering processing and memory on top of each other, chips 'leap frog' in performance
By Sharon Gaudin
Computerworld | Dec 17, 2014
http://www.infoworld.com/article/2860356...-data.html
(vested)